DielecPro – Epoxy Resin for Electrical Potting & Encapsulation

• High dielectric strength: over 20 kV/mm for safe insulation.
• Zero shrinkage: guaranteed dimensional stability during curing.
• Resistant to moisture and chemicals: ideal even in demanding environments.
• Versatile: suitable for transformers, windings, printed circuit boards, and sensitive components.
• Long-term reliability: protects your systems up to +150°C operating temperature.
• Available both transparent (ideal for LEDs and easier inspection) and with a separate black pigment option for patent protection and tamper resistance.

🔎 Why Choose DielecPro?

• Complete protection for electrical and electronic components
• Full curing in 24 hours at room temperature, with accelerated curing in an oven for faster production cycles
• Compatible with professional applications in the electronics, electrical, and industrial sectors

📦 Practical Applications

• Transformer and coil encapsulation
• Potting and protection of electronic boards (PCB)
• Sensor and connector protection
• Sealing delicate components against moisture and dust

🛠️ Instructions for Use

1. Mix Part A (Resin) and Part B (Hardener) in a 1:1 ratio by volume – by weight (100:90).
2. If desired, add 2% black pigment by weight.
3. Mix slowly for 2–3 minutes, avoiding air bubbles.
4. Pour carefully into the container or component.
5. Allow to cure for 24 hours at room temperature or 2–3 hours at 60°C for fast production cycles.
6. Recommended maximum casting thickness: 20 mm per layer.

📊 Simplified Technical Data Sheet

• Mixing ratio (volume): 1:1 – by weight (100:90)
• Working time (25°C): 40–50 min
• Full curing: 12 h at room temperature (oven acceleration possible)
• Shore D hardness: 70–55
• Dielectric strength: > 20 kV/mm
• Operating temperature: -40°C ÷ +150°C
• Resistance: moisture and chemicals